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IPC, in partnership with IPC Publishing Group (I-Connect007), will unveil an exciting new publication, “IPC Community”, at IPC APEX EXPO 2023, continuing its commitment to better serve the electronics industry and bring added value to IPC members.
The quarterly magazine will be offered in digital format and will serve as a valuable new resource designed to keep the global IPC community up to date with the latest IPC news, including industry updates, trends and technology. .
The digital edition will be available the week of January 22, 2023 at IPC APEX EXPO. The magazine will benefit from a bonus circulation with print copies exclusively available at the show.
Inside the ‘IPC Community’, readers will find feature articles that celebrate member success as well as articles on advocacy efforts, committee and standards updates, workforce education and training, factory-of-the-future solutions, advanced packaging updates, profiles of engineers and emerging members, and more.
“Our members and the entire global electronics manufacturing community regard IPC as an unwavering resource to keep them informed and informed of the latest industry developments,” said Brian Knier, Vice President of IPC, marketing, member success and sales. “We are excited about the opportunities the ‘IPC Community’ offers to take our ability to deliver timely and important information to the next level; while ensuring that the voices of IPC members are reflected in the magazine.
Michelle Te, Editor-in-Chief of IPC Community magazine, added, “With its family of publications offering original and thought-provoking content, I-Connect007 prides itself on being ‘good for the industry’. With the launch of “IPC Community”, IPC and I-Connect007 are now even better for the industry There is much to recognize and celebrate.
To subscribe to the IPC Community, visit www.ipc.org/subscribe-ipc-community. For inquiries regarding magazine advertising opportunities, contact Barb Hockaday, Advertising Sales Manager, at [email protected] To suggest a member success story, contact Michelle Te at [email protected]
08/11/2022 | Brendan Hogan, MivaTek
The circuit manufacturing industry has always been the unsung hero of the electronics age. SPC, TQM, ISO and 50 other acronyms ruled the day to govern quality and process approaches. I’ve been in the industry for 39 years and feel more like an artisan than ever – trying to figure out how to produce the impossible and maintain a profit. With smaller features, exotic materials, endless plating and press cycles, the industry feels like it’s in transition. Soon, the lines between microelectronics and PCBs will be forever blurred.
26/10/2022 | Pete Starkey, I-Connect007
Over the past two years, EIPC’s Tech Snapshot series has kept us extremely up-to-date on developments in printed circuit board materials and manufacturing technologies. But what is currently happening in the global PCB market, and how is Europe and the rest of the world affected by the current global situation? The 19th chapter (coincidentally October 19) of the series gave us a prime opportunity to find out, as two leading industry analysts offered their insights and opinions in a webinar presented and moderated by the technical director of the ‘EIPC, Tarja Rapala-Virtanen.
10/14/2022 | Nolan Johnson, I-Connect007
I have been in Washington, DC most of this week attending and reporting on the IPC Advanced Packaging Symposium. You’ll see more content from me in the weeks and months to come as I sort through and highlight the varied aspects of this groundbreaking event. If you are in this industry, advanced packaging will affect you, make no mistake.